Article formed by electroless plating
US4767665A · kind A · utility
11Cited by
11References
16Claims
0Family size
Inventor
Key dates
| Filing date | Sep 16, 1985 |
| Grant date | Aug 30, 1988 |
| Priority date | — |
| Expiry date | Sep 16, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention describes a platable plastic material that uses a phosphide compound as a filler at levels of 5 to 40 weight percent. The phosphide filler used in this way has good dielectric properties and is non-conductive, but the phosphide provides coupling sites for a conductive plating to initiate and to bond to the filler and thus to the plastic. Surface treatment of the plastic may be needed to expose the particles but this invention removes requirements for catalytic treatment with noble metal chlorides and relies on bonding mechanisms other than the mechanical grip on a rough surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.