Metal cored board and method for manufacturing same
US4767674A · kind A · utility
36Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1985 |
| Grant date | Aug 30, 1988 |
| Priority date | — |
| Expiry date | Jul 26, 2005 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
It is disclosed that a metal cored board which comprises an electrically conductive layer whose one surface at least composed of a hardly oxidizable metal, an insulating organic polymer layer baked on the surface of the hardly oxidizable metal, and a metal core adhered on the insulating organic polymer layer, and a method for manufacturing a metal cored board, which comprises a step to coat the surface of a hardly oxidizable metal layer of an electrically conductive metal foil with an insulating varnish, a step to bake a layer of the varnish, and a step to adhere a metal core on the baked varnish layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.