Thermoplastic polyamide moulding material having reduced water uptake containing epoxy compound
US4767811A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 5, 1987 |
| Grant date | Aug 30, 1988 |
| Priority date | — |
| Expiry date | Aug 5, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K5/1515
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic polyamide molding materials having reduced water uptake are obtained by the addition of 0.3-15% by weight, based on the polyamide, of an epoxide compound containing at least one oxirane group of general formula I ##STR1## in which R.sub.1 is hydrogen, alkyl, aralkyl or aryl, and R.sub.2 is hydrogen, alkyl, dialkyl, aryl, or a group of general formula II EQU R.sub.3 --X--CH.sub.2 -- (II) in which X can be oxygen, sulfur or substituted nitrogen and R.sub.3 can be a substituted or non-substituted aromatic, cycloaliphatic, araliphatic or aliphatic group which can also contain further oxirane groups and be interrupted by other groupings. Glycidyl ethers are particularly preferred epoxide compounds. The molding materials of the invention are suitable especially for use in the construction of motor vehicles, instruments, apparatus or machines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.