Cooling system for semiconductor modules
US4768581A · kind A · utility
39Cited by
19References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 1987 |
| Grant date | Sep 6, 1988 |
| Priority date | — |
| Expiry date | Apr 6, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/903
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling structure for a semiconductor package wherein the cooling fluid is circulated over the cooling fins over short distances. The fluid flow is separated into multiple flow streams, passed over the fins for short distances and exhausted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.