Article containing conductive through-holes
US4769269A · kind A · utility
3Cited by
6References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1987 |
| Grant date | Sep 6, 1988 |
| Priority date | — |
| Expiry date | Mar 25, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive through-hole hole is formed by through a dielectric sandwiched between conductors forming a noncircular hole in a conductor, etching a hole through the dielectric and by deforming at the conductor which has been undercut during the etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.