Alumina materials for low temperature co-sintering with refractory metallization
US4769294A · kind A · utility
13Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 1986 |
| Grant date | Sep 6, 1988 |
| Priority date | — |
| Expiry date | Nov 26, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Substrates consisting of at least 98% narrow size distribution ceramic particles are co-sinterable with metallized paste to which selected compositions of glass have been added. Substrates produced in accordance with the present invention exhibit superior thermal conductivity, low shrinkage variability, and smoother and more homogeneous surface finish.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.