Method and apparatus for handling leaded and leadless surface mountable components
US4769904A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 1987 |
| Grant date | Sep 13, 1988 |
| Priority date | — |
| Expiry date | May 11, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention involves a method and apparatus for sequencing leadless and leaded surface mountable components, feeding them directly from a sequencer to chip placement heads, and placing them at selected locations on a circuit board. The chip carriers of an endless chain conveyor carry each component of the sequence of components to a chip placement head. Direct supply from a sequencer having the chip carriers and a series of individual programmably controlled dispenser heads provides for quick and flexible variation of the input sequence without manual intervention. A plurality of the chip placement heads are mounted on a turret assembly to facilitate continuous unloading of the chip carriers and orienting, centering, and squaring of the components prior to placement on a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.