Stabilization of intraconnections and interfaces
US4770716A · kind A · utility
2Cited by
1References
20Claims
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Key dates
| Filing date | Apr 16, 1987 |
| Grant date | Sep 13, 1988 |
| Priority date | — |
| Expiry date | Apr 16, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
Abstract
Stabilization of energy sensitive semiconductor devices by forming initial electrodes which are exposed through an overlying layer of semiconductor, dipping the exposed electrodes in solutions containing specified chemicals, such as metallic ion solutions of nickel, cobalt, chromium and related metals, followed by rinsing, drying, and the final deposition of an overlying electrode by metallization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.