Method of enclosing an object
US4770833A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 15, 1987 |
| Grant date | Sep 13, 1988 |
| Priority date | — |
| Expiry date | Apr 15, 2007 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2995/0015
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of enclosing an object, such as an electronic component, within a homogeneous block of microporous thermal insulation material comprises charging a first predetermined amount of a loose microporous thermal insulation mixture into a die and compacting the insulation mixture into a block for supporting the object to be insulated. A recess may be formed in the compacted mixture for receiving the object. The object is then located on the compacted mixture and a second predetermined amount of loose microporous thermal insulation mixture is charged into the die. The loose insulation mixture is compacted against the block of already compacted insulation material which causes the two charges of insulation mixture to merge and to form a homogeneous block enclosing the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.