Wire bonded microfuse and method of making
US4771260A · kind A · utility
45Cited by
3References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 24, 1987 |
| Grant date | Sep 13, 1988 |
| Priority date | — |
| Expiry date | Mar 24, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2085/0414
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microfuse (10) with a ceramic chip (12), thick film pads (14), fusible wire (16), attached to pads (14) without solder or flux, ceramic coating (18) and plastic body (20). External lead (24) configuration can be axial, radial or surface mount. The method of manufacturing the fuse (10) is improved by utilizing a wire bonding technique in order to improve the quality of the manufacturing process and increase the reliability in performance of the fuse and reduce manufacturing cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.