Molded product having printed circuit board
US4772496A · kind A · utility
38Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1986 |
| Grant date | Sep 20, 1988 |
| Priority date | — |
| Expiry date | Jun 16, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31699
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A molded product having a printed circuit board on a thermoplastic layer is disclosed, the printed circuit board comprising a conductive metal layer and a thin-wall body containing a crosslinked product of a mixture of (A) 1 to 99 wt % of an ethylenic copolymer containing at least one monomer unit selected from the group consisting of monocarboxylic acid unit, dicarboxylic acid unit, acid anhydride unit thereof and half ester unit thereof and (B) 99 to 1 wt % of an ethylenic copolymer containing at least one monomer unit selected from the group consisting of hydroxyl unit, amino unit and oxirane unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.