Silicon carbide capillaries
US4772498A · kind A · utility
18Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 1986 |
| Grant date | Sep 20, 1988 |
| Priority date | — |
| Expiry date | Nov 20, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/131
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A capillary for use in ball bonding tools designed to bond metal leads to the bonding pads on a microchip and pads or leads on a chip support is formed by chemically vapor depositing a substantially smooth silicon carbide coating having high electrical resistivity onto a substrate which is then removed by etching or combustion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.