Printed circuit board base material
US4772509A · kind A · utility
34Cited by
4References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 1987 |
| Grant date | Sep 20, 1988 |
| Priority date | — |
| Expiry date | Apr 13, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/3878
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A printed circuit board base prepreg material is provided of a porous, expanded polytetrafluoroethylene (PTFE) membrane or fabric impregnated with a polyimide resin varnish. Upon curing, a printed circuit board base material of porous, expanded PTFE impregnated with polyimide resin is provided. The base material of the invention may be laminated to a glass fabric to improve strength and dimensional stability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.