Thermoplastic resin composition
US4772664A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1986 |
| Grant date | Sep 20, 1988 |
| Priority date | — |
| Expiry date | Dec 23, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/905
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition substantially constituted of (A) 25 to 70% by weight of a polyamide, (B) 25 to 70% by weight of a polyphenylene ether and (C) 2 to 25% by weight of a block copolymer having at least one polymer block mainly comprised of a vinyl aromatic compound and at least one polymer block mainly comprised of a conjugated diene compound having the content of the vinyl aromatic compound in the range of 25 to 85% by weight; wherein the polyamide forms a continuous phase, and, in the continuous phase, the polyphenylene ether is dispersed to form a dispersed phase having an average particle diameter ranging from 0.5 to 10 .mu.m, and further, substantially all of the block copolymer is micro-dispersed in the dispersed phase of the polyphenylene ether. The composition is widely used as outerplate materials or wheel caps of automobiles, as electrical or electronical parts, especially the various connectors which are used in automobiles, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.