Multilayer circuit prototyping board
US4772864A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 9, 1987 |
| Grant date | Sep 20, 1988 |
| Priority date | — |
| Expiry date | Feb 9, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09045
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer circuit prototyping board for prototyping circuits in a three-layer transmission line structure. The multilayer circuit prototyping board includes grooves and mesas on one side thereof, with wires to be run in the grooves for interconnecting electronic components. The electronic components are mounted on the bottom surface of the prototyping boards with leads protruding through holes in a bottom ground plane into the grooved portions. Wires or solder bridges are located within the grooves for interconnecting the leads of the various electronic components. A removable top ground plane is then placed atop the board base for completing the three-layer structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.