Wafer handler
US4773687A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 1987 |
| Grant date | Sep 27, 1988 |
| Priority date | — |
| Expiry date | May 22, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A wafer handling technique allows for picking up a wafer from its front side. One or more vacuum ports pull the periphery of the wafer into contact with a ledge raised from a broad surface, providing a friction force that prevents lateral movement of the wafer. A port in the broad surface of the handler flows pressurized gas onto the wafer, thereby preventing contact between the handler and the interior of the wafer. The handler may be sized to be relatively thin, and to cover less than half of the surface of the wafer, thereby allowing for readily loading wafers back-to-back in a furnace boat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.