Thin film mandrel
US4773971A · kind A · utility
45Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1986 |
| Grant date | Sep 27, 1988 |
| Priority date | — |
| Expiry date | Oct 30, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D1/10
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A reusable mandrel and method of making a reusable mandrel is presented. This mandrel has a substrate with a conductive film layer. Upon the conductive film layer, a dielectric mold resides. An etched thin film mandrel is also presented. This mandrel has a substrate covered with a conductive film layer. This conductive film layer is etched to form a mold for the device to be manufactured. These mandrels facilitate the manufacture of high quality precision devices. In particular, they can be used to manufacture orifice plates for thermal ink jet printers by electrodeposition process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.