Automated method for the analysis and control of the electroless metal plating solution

US4774101A · kind A · utility

Assignee

• American Telephone and Telegraph Company, AT&T Technologies, Inc. · US

Inventors

• John E. Harris · Friendswood, US
• Walter H. Rees, Jr. · Mechanicsville, US

Key dates

• Filing date: Dec 10, 1986
• Grant date: Sep 27, 1988
• Expiry date: Dec 10, 2006

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C18/1683
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An apparatus coupled to an electroless copper plating bath for analyzing controlling, on-line, the primary constituents of the bath is described. The apparatus detects and controls not only the copper concentration of the bath by optical means, but the concentrations of hydroxyl ion, formaldehyde reducing agent and cyanide ion as well.