Fabrication of a multilayer conductive pattern on a dielectric substrate
US4774127A · kind A · utility
19Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1987 |
| Grant date | Sep 27, 1988 |
| Priority date | — |
| Expiry date | Jun 15, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pattern of conductive material is formed on a substrate of dielectric material. The substrate comprises a layer of flexible dielectric material having a layer of dimensionally-stable material adhered to one main face. The pattern is formed on the opposite main face of the layer of flexible dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.