Method of making a multipad solder preform
US4774760A · kind A · utility
22Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1987 |
| Grant date | Oct 4, 1988 |
| Priority date | — |
| Expiry date | Oct 9, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solder preform and technique for making same is disclosed for use in a one time flux process for attaching electronic modules to printed circuit substrates via plated through holes or surface mount pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.