Method of making high metal content circuit patterns on plastic boards
US4775439A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1983 |
| Grant date | Oct 4, 1988 |
| Priority date | — |
| Expiry date | Jul 25, 2003 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0278
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A low temperature method of forming a circuit pattern on a plastic substrate which comprises applying a slurry of a vaporizable solvent, metal particles and a small quantity of binder in the shape of the circuit pattern desired to a removable layer, vaporizing the solvent, covering the powdered metal and binder with an adhesive to hold the powdered metal and carrier in place on the removable layer, laminating the hydrocarbon containing substrate with pressure and heat to cause compacting of said powder and bonding of said compacted powder to said substrate by adhesive layer, said heat being insufficient to destroy said adhesive, substrate and removable layer, and separation of the removable layer. A circuit pattern held on a removable layer by an adhesive overlying same is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.