Treatment of a polyimide surface to improve the adhesion of metal deposited thereon
US4775449A · kind A · utility
42Cited by
5References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1986 |
| Grant date | Oct 4, 1988 |
| Priority date | — |
| Expiry date | Dec 29, 2006 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of improving the adhesion of metal applied on a polyimide surface is disclosed, in which the surface is first treated with an adhesion-promoting compound containing a nitrogen-oxygen moiety prior to plating of the metal thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.