Composition and process for conditioning the surface of polycarbonate resins prior to metal plating
US4775557A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 1987 |
| Grant date | Oct 4, 1988 |
| Priority date | — |
| Expiry date | Nov 9, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/381
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for specially conditioning and etching a polycarbonate resin prior to metal plating to enhance the coverage and adhesiveness of metal plating to the resin. The swellant composition comprises a compound represented by the general formula, EQU R.sub.1 (OC.sub.n H.sub.2n).sub.m O--R.sub.2 wherein R.sub.1 and R.sub.2 are independently selected from the group consisting of aryl groups and alkyl groups of 1-4 carbon atoms, n is 2 to 4 and m is 1 to 5. The swelled resin is then etched using, preferably, a highly alkaline composition such as a solution containing greater than about 100 g/l NaOH. Other etchants such as chromic acid may also be used. The resin is now ready for plating using conventional techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.