Saw device
US4775814A · kind A · utility
27Cited by
3References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 1987 |
| Grant date | Oct 4, 1988 |
| Priority date | — |
| Expiry date | May 19, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/14541
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
In a SAW device comprising a piezoelectric substrate and at least one set of metallic electrodes formed on the piezoelectric substrate, at least one set of the electrodes have a laminated structure comprised of a layer of an aluminum film added with an impurity at a concentration of 6 wt. % or less and another layer of a film of pure aluminum or aluminum added with an impurity at a concentration of 0.4 wt. % or less. The SAW device having the laminated structure of electrodes can handle high frequency electric signals of higher power and/or larger amplitudes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.