Patent · US Expired

Modular image sensor structure

US4775895A · kind A · utility

21Cited by

5References

6Claims

0Family size

Assignee

Heimann GmbH · DE

Inventors

Ulrich Traupe · Wiesbaden, DE
Manfred Dennhoven · Wiesbaden, DE
Bernd Heimann · Reiffelbach, DE

Key dates

Filing date	Oct 30, 1986
Grant date	Oct 4, 1988
Priority date	—
Expiry date	Oct 30, 2006

Classification

Technology area (CPC H)Electricity
CPC primaryH10F39/191
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An image sensor module for reading optical information on an original and converting the information into electrical signals, has a row of opto-electrical sensors, each sensor having associated processing circuitry integrated therewith in the module. The drive module functions as the substrate for the sensors as well, which are separated from the substrate by an insulator layer, having openings therein for making electrical connection between the substrate and the sensor.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.