Photosensitive resin composition
US4777114A · kind A · utility
18Cited by
2References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Sep 18, 1987 |
| Grant date | Oct 11, 1988 |
| Priority date | — |
| Expiry date | Sep 18, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F8/44
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A photosensitive resin emulsion composition comprising an aqueous emulsion of a film-forming resin and a protective colloid for said emulsion, wherein the protective colloid comprises at least one photosensitive saponified polyvinyl acetate derivative which is at least partially grafted onto the film-forming resin, and the photosensitive saponified polyvinyl acetate derivative comprises a backbone formed of saponified polyvinyl acetate and at least one photosensitive unit and at least one hydrophobic unit bonded to the backbone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.