Wire wrap single in-line package
US4777562A · kind A · utility
1Cited by
4References
4Claims
0Family size
Inventor
Key dates
| Filing date | Jul 6, 1987 |
| Grant date | Oct 11, 1988 |
| Priority date | — |
| Expiry date | Jul 6, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2036
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thick film passive network on an alumina substrate, the passive elements being terminated by conducting metal leads. The network, substrate and a small portion of each lead is encapsulated in a material with high insulation characteristics. The geometry of the leads and overall package alignment characterizes the device as a wire wrap SIP, use of which provides the capability of high board density and closer board-to-board spacing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.