Leadform for use with surface mounted components
US4777564A · kind A · utility
22Cited by
21References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1987 |
| Grant date | Oct 11, 1988 |
| Priority date | — |
| Expiry date | Nov 17, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved leadform for use with surface mount components is described. The improved leadform provides a connection to a printed circuit substrate which is highly resistant to stress related failures. The leadform is configured so that the connection utilizes a relatively greater area of the leadform for contact with a solder connection resulting in a more compliant connection. In addition, the present invention provides a preparation for the printed circuit media which allows the substrate media to absorb stresses which occur due to thermal cycling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.