Leadframe for flash-free insert molding and method therefor
US4778146A · kind A · utility
4Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 1987 |
| Grant date | Oct 18, 1988 |
| Priority date | — |
| Expiry date | Mar 20, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Improved leadframe and method for the insert molding of semiconductor components or the like. A plurality of leads separated by zero-flash tab means for controlling the flash during molding are formed in a single sheet of material. The zero-flash tab means are stamped from the stock sheet and then reinserted into the area between adjacent leads. The zero-flash tab means desirably comprise a ridge section for strength and facilitating removal after the molding operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.