Hermetically sealed glass fiber bushing

US4779788A · kind A · utility

Assignee

• Standard Elektrik Lorenz AG · DE

Inventor

• Rolf Rossberg · Schwieberdingen, DE

Key dates

• Filing date: Nov 12, 1987
• Grant date: Oct 25, 1988
• Expiry date: Nov 12, 2007

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4248
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

To avoid having to metallize a bare glass fiber prior to soldering it into a hole of a metal part to obtain a hermetically sealed lead-through bushing, the solder is permitted to shrink onto the glass fiber. This is achieved by either soldering an additional solder body to the metal part outside the hole or providing the wall of the hole with a nonsolderable coating over part of its length. If the metal part is designed as a sleeve, a recess exposing part of the hole causes the solder to firmly shrink on to the bare glass fiber during solidification. The hermetic seal is obtained by arranging the connections of the solder with the metal part and with the glass fiber essentially one behind the other in the longitudinal direction of the glass fiber.