Job oriented method and apparatus utilizing molten solder for procedures such as soldering and desoldering
US4779790A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1986 |
| Grant date | Oct 25, 1988 |
| Priority date | — |
| Expiry date | Dec 11, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus for performing an operation with molten solder, such as soldering or desoldering a component mounted on a substrate such as a PCB including an enclosed reservoir, the reservoir including a contained space above the molten solder; a hollow nozzle for receiving solder from the reservoir; an element for conveying the molten solder in the reservoir to the nozzle; and a source connected to the contained space for introducing a pressurized gas into the space to raise the solder through the conveying means to a predetermined level within the nozzle and maintaining said solder at said predetermined level to thus effect the operation with the molten solder and then removing the gas to return the solder to the reservoir. The gas is pulsed at least during the time the solder approaches and reaches the predetermined level. The apparatus includes a plurality of different size hollow nozzles for receiving solder from the reservoir where the nozzles are removably attachable with respect to the reservoir. A unique solder reservoir configuration is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.