Conductive lead arrangement
US4780098A · kind A · utility
20Cited by
1References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 19, 1987 |
| Grant date | Oct 25, 1988 |
| Priority date | — |
| Expiry date | Aug 19, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/933
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A conductive lead for connection to a first conductive area of a device having two opposed surfaces with a conductive area comprises an elongated conductive body formed from a substantially flat strip of a resilient material. The conductive body has a pair of opposite arms adapted to engage the opposed device surfaces resiliently. A non-conductive element is held by one arm and is adapted to engage the other surface of the device to insulate the lead from the other surface. The conductive area of the other surface is insulated by the lead and the non-conductive element from the conductive area of the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.