Molding materials of polyoxymethylene homopolymers and/or copolymers and thermoplastic polyurethane elastomers having improved heat stability, their preparation and their use

US4780498A · kind A · utility

Assignee

• BASF SE

Inventors

• Heiner Goerrissen · Ludwigshafen, DE
• Dietrich Saenger · Bischofswerda, DE
• Wilhelm Schuette · Speyer, DE
• Manfred Walter · Nuremberg, DE

Key dates

• Filing date: Jul 24, 1987
• Grant date: Oct 25, 1988
• Expiry date: Jul 24, 2007

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L75/04
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Molding materials of PA0 (A) one or more polyoxymethylene homopolymers and/or copolymers and PA0 (B) one or more thermoplastic polyurethane elastomers, PA0 (C) with or without additives, contain, as an additive, PA0 (D) one or more alkaline earth metal silicates, advantageously in an amount of from 0.005 to 2% by weight, based on the weight of the components (A) and (B), for improving the heat stability, reducing the tendency to discoloration and minimizing the free formaldehyde content. To prepare the molding materials, the components (A), (B), (D) and, if required (C) are advantageously melted together in an extruder at from 150.degree. to 260.degree. C. The molding materials are useful for the production of films or moldings, which are used, for example, in the automotive, electrical appliances and electronics industries.