Deposition of metal or alloy film
US4781800A · kind A · utility
22Cited by
4References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 1987 |
| Grant date | Nov 1, 1988 |
| Priority date | — |
| Expiry date | Sep 29, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/028
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method and apparatus for plating metal or metal alloy on a well-defined area of the surface of an article by forming a liquid plating bath having its surface maintained slightly above the rim of a container by surface tension and passing the surface to be plated in contact with the surface of the bath and spaced from the rim of the container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.