Production of dielectric boards
US4781991A · kind A · utility
5Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 1987 |
| Grant date | Nov 1, 1988 |
| Priority date | — |
| Expiry date | Oct 9, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12993
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Copper substantially free of micro-pores is electrodeposited on a polished surface of a stainless steel, titanium, or chromium-plated steel press plate. The copper layer is then provided with a matte surface of copper of dendritic structure which is subsequently bonded to a dielectric material under the application of heat and pressure in a laminating press. The resulting copper-clad dielectric board separates from the press plate, which can then be re-used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.