Homogeneous thermoset terpolymers
US4782116A · kind A · utility
10Cited by
7References
36Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 6, 1987 |
| Grant date | Nov 1, 1988 |
| Priority date | — |
| Expiry date | Jul 6, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0326
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Homogeneous thermoset terpolymers which may be used in the preparation of laminates for circuitry boards will comprise a diepoxide of a polyether of a polyphenol, a dicyanate ester of a polyether of a polyphenol and an alkenyl aryl compound. The polymers are prepared by admixing a solution of the diepoxide of a polyether of a polyphenol and an alkenyl aryl compound with a second solution of the dicyanate ester of a polyether of a polyphenol and the alkenyl aryl compound at elevated temperatures. The resulting terpolymer will possess desirable characteristics such as high glass transition temperature and low dielectric constant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.