Encapsulation of electronic components with poly(arylene sulfide) containing mercaptosilane
US4782195A · kind A · utility
3Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1982 |
| Grant date | Nov 1, 1988 |
| Priority date | — |
| Expiry date | Jul 16, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Electronic components can be encapsulated with a poly(arylene sulfide) composition containing a mercaptosilane such as, for example, 3-mercaptopropyltrimethoxysilane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.