Patent · US Expired

Method and apparatus for resistance adjustment of thick film thermal print heads

US4782202A · kind A · utility

21Cited by
10References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 29, 1986
Grant dateNov 1, 1988
Priority date
Expiry dateDec 29, 2006

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49082
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A method and an apparatus for adjusting the resistance value of a thermal head assembly. One voltage pulse or a set of voltage pulses of a preselected peak value are impressed on the heat generating resistor elements of the thermal head assembly. The resistance values of the resistor elements are then measured and compared with the predetermined target value. If the measured resistance values are above the target value, the resistor elements are subjected to another pulse or set of pulses having a peak value a little higher than the preceding one. Then, the resistance values are again measured and compared with the target value. Thus, the resistance values are decreased by successively impressing voltage pulses with the peak value thereof being increased little by little, until the resistance values become lower than the target value.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.