Electrically insulating thermally conductive pad for mounting electronic components
US4782893A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 23, 1988 |
| Grant date | Nov 8, 1988 |
| Priority date | — |
| Expiry date | Feb 23, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The pad of the present invention is comprised of a thin film of high dielectric strength material which is impregnated with diamond powder. The diamond pieces are relatively uniform in size and have a minimum dimension which is greater than the thickness of the film. In one embodiment, a 5,000-10,000 angstrom boundary layer of copper is formed on both sides of the film by a vacuum deposition or electroless dipping and thicker cover layers are electroplated on top of this boundary layer, if desired, to make the pad rigid. In addition, a copper or aluminum substrate can be clad to one or both cover layers to provide additional rigidity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.