Method of bonding metal skins to internal support structures
US4783228A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 3, 1986 |
| Grant date | Nov 8, 1988 |
| Priority date | — |
| Expiry date | Jul 3, 2006 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64C2001/0081
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
Disclosed is a method and apparatus for joining a metal skin to an internal structure comprising forming the metal skin to a permanent desired contour; assembling a lattice of ribs and spars and bonding the lattice to the contoured skin and subsequently forming the completed structure by bonding a pair of skin-superstructure assemblies together. Also disclosed is a diaphram designed to apply pressure to the skin only along structurally supported area of the skin to prevent damage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.