Electronic signal time dealy device and method of making the same
US4783359A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1986 |
| Grant date | Nov 8, 1988 |
| Priority date | — |
| Expiry date | Nov 18, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A preferably low dielectric constant polymeric bonding layer is applied or bonded (i.e., laminated or coated) to at least one side of a preferably low dielectric constant polymeric delay line substrate. Preferably, the melting or softening point of the bonding film is lower than the melting or softening point of the substrate so that the application (e.g. lamination) step is carried out at a temperature which is above the softening point of the bonding film, but below the softening point of the substrate (thereby insuring the integrity of the delay line circuit). Thereafter, the delay line/bonding layer assembly is rolled up and head sealed so as to melt the bonding layer, thus heat sealing the delay line package. As the package heats up (in, for example, a tightly fitting die), the materials expand and provide sufficient pressure to bond the circuit together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.