High heat conductive insulated substrate and method of manufacturing the same
US4783368A · kind A · utility
118Cited by
4References
61Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1986 |
| Grant date | Nov 8, 1988 |
| Priority date | — |
| Expiry date | Nov 5, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An insulated substrate having high thermal conductivity comprising a substrate having a thermal conductivity of not less than 50 W/m.k., and an insulating layer having high thermal conductivity coated on the substrate; and a method of producing the insulated substrate characterized in that an insulating layer is formed on a substrate by applying DC voltage and RF power to the substrate and providing a magnetic field parallel to the surface of the substrate. The insulated substrate has good heat conductivity, thermal resistance and smooth surface, whereby exfoliation can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.