Non-thermoset thermally stable capped epoxy resin compositions
US4783509A · kind A · utility
7Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 1987 |
| Grant date | Nov 8, 1988 |
| Priority date | — |
| Expiry date | Nov 10, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D163/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat stable, non-thermoset epoxy resin composition is disclosed which comprises reacting (A) a mixture containing (1) a relatively high molecular weight epoxy resin and (2) a relatively low molecular weight epoxy resin with (B) a monohydric phenol, a monocarboxylic acid or anhydride thereof or a monohydric alcohol. The composition does not exhibit an excessive viscosity increase at elevated temperatures making it particularly suitable for use in highway marking paint applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.