Cooling system for an electronic circuit device
US4783721A · kind A · utility
52Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1987 |
| Grant date | Nov 8, 1988 |
| Priority date | — |
| Expiry date | Jul 30, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling system including a cooling module which has a heat transfer plate that is exposed to a flow of coolant and is elastically biased toward a circuit component on a printed circuit board for transferring heat dissipated by the component to the coolant, and means for guiding and preventing improper alignment of the transfer plate as the same is resiliently biased toward the circuit component. The coolant module may include a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.