Manufacturing miniature hearing aid having a multi-layer circuit arrangement
US4783815A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 12, 1987 |
| Grant date | Nov 8, 1988 |
| Priority date | — |
| Expiry date | Nov 12, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
As opposed to standard circuit board fabrication techniques, whereby plated holes are commonly bored through all the layers of a multilayer board, the circuit board for a hearing aid according to the invention is fabricated by alternatingly forming plated holes in subpackets of the circuit board and then joining together the subpackets until the completed multilayer board is bonded together. The circuit board can be provided with plated internal holes, plated blind holes as well as standard through holes. An especially high component density on the two surfaces of the circuit board is acheived, as well as the fabrication of extremely thin and flexible multilayer circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.