Heat conductive circuit board and method for manufacturing the same
US4784893A · kind A · utility
6Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 1987 |
| Grant date | Nov 15, 1988 |
| Priority date | — |
| Expiry date | Feb 13, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/656
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat conductive circuit board includes an insulating layer provided on a metal substrate, and an electrically conductive metal foil formed on the insulating layer, and the insulating layer is formed by impregnating an alumina paper with organic polymer. The alumina paper is made by subjecting a material containing alumina fiber as the principal components to a paper-making process. The insulating layer has excellent properties of heat transfer not only in the thickness direction but also in the surface direction, and thus, the heat conductive circuit board is excellent in heat dissipation properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.