Adhesively bonded photostructurable polyimide film
US4786569A · kind A · utility
21Cited by
36References
49Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 1986 |
| Grant date | Nov 22, 1988 |
| Priority date | — |
| Expiry date | Aug 27, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Coated material containing in successive order PA1 (a) a substrate, PA1 (b) a photostructurable negative-working thermostable adhesive and PA1 (c) a self-supporting photocrosslinkable polyimide film. This arrangement can be used for producing relief images by means of photolithographic processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.