Missing wire detector
US4786860A · kind A · utility
12Cited by
5References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 8, 1987 |
| Grant date | Nov 22, 1988 |
| Priority date | — |
| Expiry date | Apr 8, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The absence of a wire (40) in proper position under the bonding tool (32) of an ultrasonic wire bonder is detected by energizing the bonder transducer (14) while the wire is pulled to break it after the second bond (B) has been made. The pulling of the wire to break it changes the transducer impedance, which is monitored to signal presence or absence of a wire in its proper location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.