Method for producing materials for co-sintering
US4788046A · kind A · utility
37Cited by
13References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1987 |
| Grant date | Nov 29, 1988 |
| Priority date | — |
| Expiry date | Aug 13, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to glass-ceramic packages for integrated circuits containing multi-layer, interconnected thick film wiring patterns obtained by co-sintering a glass-ceramic composite and copper, silver, palladium or gold based conductors at temperatures not exceeding about 1000.degree. C. The dielectric systems disclosed herein contains composites of borosilicate glasses and crystalline fillers which are fabricated by either mixing glass frit and the filler or by a sol-gel coating process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.