Patent · US Expired

Power semiconductor module

US4788626A · kind A · utility

110Cited by

1References

10Claims

0Family size

Assignee

Brown, Boveri & Cie AG · DE

Inventors

Arno Neidig · Plankstadt, DE
Reinhold Bayerer · Warstein, DE
Bertold Hahn · Hofheim, DE

Key dates

Filing date	Feb 12, 1987
Grant date	Nov 29, 1988
Priority date	—
Expiry date	Feb 12, 2007

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power semiconductor module includes a plastic housing having an interior. A substrate in the form of a ceramic plate with upper and lower surfaces is inserted in the housing as a housing bottom. Metallizations are disposed on the upper and lower surfaces of the ceramic plate. The metallization on the upper surface of the ceramic plate faces the interior of the housing and is structured to form conductor paths. Power semiconductor components, connecting elements and terminal elements for external termimals all are disposed on the upper surface of the ceramic plate. A frame is connected to the substrate in the interior of the housing for sealing against moisture.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.